doc. no : qw0905-ldgm 2043/h295-a01 rev. : a date : 02 - sep. - 2009 data sheet ldgm2043/h295 round type led lamps pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
25% 50% 75% 100% -60 x -30 x 50% 75% 025% 100% 0 x 30 x 60 x note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only part no. ldgm2043/h295 package dimensions page 1/6 3.0 4.0 4.2 5.2 1.5max 2.54typ 1.0min 0.5 typ 25.0min
j -30 ~ +100 tstg storage temperature 2700 7700 54 4.0 3.5 36 ldgm2043/h295 ingan/gan note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. spectral halfwidth ??f nm typical electrical & optical characteristics (ta=25 j ) part no dominant color water clear green emitted material lens wave length f nm d viewing angle 2 c 1/2 (deg) forward voltage @20ma(v) luminous intensity @20ma(mcd) max. typ. min. max ratings dgm 30 100 50 120 -20 ~ +80 500 i fp peak forward current duty 1/10@10khz operating temperature electrostatic discharge reverse current @5v power dissipation t opr esd pd ir forward current absolute maximum ratings at ta=25 j symbol parameter i f ma j v g a mw unit ma ligitek electronics co.,ltd. property of ligitek only page 2/6 static electricity or power surge will damage the led. use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. ldgm2043/h295 522 534 max min.
3/6 page ligitek electronics co.,ltd. property of ligitek only a28 a29 a26 group a27 brightness code for standard led lamps luminous intensity(mcd) at 20 ma min. max. part no. ldgm2043/h295 a30 2700 3400 4000 5000 6200 6200 5000 3400 4000 7700 1s 534 dominant wave length(nm) at 20 ma min. 1q 1r 1p 522 group color code max. 528 531 525 525 531 528
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 450 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 4/6 page part no. ldgm2043/h295
temp( x c) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. time(sec) 5 x /sec max 2 x /sec max preheat 60 seconds max 0 25x 0x 50 120x 100 260x 260 x c 3sec max 150 dip soldering preheat: 120 x c max preheat time: 60seconds max ramp-up 2 x c/sec(max) ramp-down:-5 x c/sec(max) solder bath:260 x c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 x c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. ldgm2043/h295
1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec thermal shock test high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs low temperature storage test high temperature storage test operating life test reliability test: test item test condition mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. page 6/6 description reference standard ligitek electronics co.,ltd. property of ligitek only part no. ldgm2043/h295
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